应用案例

FOTRIC 226 Thermal Camera for Circuit Board Test

2019-05-31

Circuit board heating

The circuit board heats up because of wire resistance and other reasons:

1、Power issues of electronic component: When the power carrying capacity of component is too low, the component heats up and the heat are transferred to the circuit board.

2、Design problem of circuit board: Unreasonable design of high current lines on circuit board. For example, the current-carrying capacity of copper foil is smaller than 3 Amps/mm2.

3、Layout problem: Poor heat dissipation conditions and environment of circuit board. For example, the circuit board is too close to some heating or heat dissipation devices; there is no necessary ventilation duct or the entire circuit board is sealed, which leads to failure of heat dissipation. The accumulation of heat causes subsequent circuit board heating.

4、Power consumption and heat dissipation problems: The margin of total power consumption of circuit board is too small. For the circuit board for power carrying, the margin shall be 2.5-3 times of the total power consumption. A cooling fan shall be added when needed.

5、Other failure problems: Short-circuit; damage of component; improper welding; faulty welding; poor contact, etc.

 

What problems need to be solved by customers?

  • Reasonable layout of components: High-power devices heat up seriously. The thermal load can be balanced with properly arrangement of these devices.
  • Identifying the overheating devices: The incompatible device selection and long-term operation with overheating lead to premature failure of the entire circuit board.
  • Faulty and short welding: Poor contact will lead to inexplicable failures and increase customer service cost.
  • Optimization of heat dissipation: Locate thermal load area, evaluate the effect of current thermal design, and develop optimization and improvement plan.
  • Short circuit: A design taboo.

 

Current solution and their disadvantages

Thermocouple and Data Acquisition (DAQ)

  • The thermocouple contacts with the components and the temperature data are collected through multichannel DAQ system. Temperature measurement is more accurate, but there are a lot of inconveniences;
  • It's time-consuming and inefficient to place the thermocouple on devices (application of thermal conductive adhesive, close contact and paste, etc.) in accordance with related regulations;
  • The attached thermocouple changes the heat distribution of devices, especially those small-sized components;
  • The thermocouple has temperature inertia which causes the lag between the temperature collected and the actual temperature;
  • Due to the limited number of channels, few locations to place thermocouple are picked up merely based on the experience of operator, which causes a lot of detection blind spots;
  • Some PCBs carry the voltage and current that are harmful and possibly cause threat to personal safety.

 

Infrared Thermometer Gun

  • There are still many problems in the infrared thermometer gun although it is convenient to use:
  • It measures only single spot each time, and few detection locations may be picked up merely based on experience which causes a lot of detection blind spots;
  • Unable to analyze the trend of temperature change;
  • Unable to test multiple spots at the same time, so the data synchronization is poor;
  • Unable to store mass data, so the handwritten record is always required;

 

How FOTRIC products help the customers to solve the problems product and the advantages?

  • Fotric 226 three-in-one (3-in-1) infrared camera can collect 110,592 temperature values on a single thermal image, collect and save the temperature data of the entire circuit board at one time, and obtain temperature values efficiently without detection blind spots.
  • Fotric 226 thermal imager can be connected to the computer and configured with professional software AnalyzIR to act as online monitoring thermal camera with 110,592-channel DAQ to record fully-radiometric thermal video stream.

  • The fully-radiometric thermal video stream preserves the original temperature of each pixel and thus customers can analyze the temperature variation curve of any device/area of interest.
  • Configured with macro lens and R&D test platform, Fotric 226 thermal camera can analyze the temperature distribution of micro devices (size of device in white box is 3mm*1.5mm).

  • Non-contact temperature measurement, no impact to target temperature field and no risk of electric shock;
  • Real-time measurement of temperature variation;

 

Configuration Package

Fotric 226 three-in-one thermal camera; M50-226 macro lens; B1 R&D test platform.

 

Other Customers Need to Solve Such Problems.

  • R&D departments of consumer electronics including household appliances, cellphones, smartphones, LED, IoT hardware/devices, etc.
  • R&D departments of industrial electronics companies including automobile, power, energy, frequency converter, power devices, etc.
  • Electronics-related institutions and departments of university/scientific research institutions;