A smart 600 R&D thermal camera with a macro lens, test bench, and powerful PC software is designed for engineering and product development, whose quality is guaranteed by the top-end hardware. It provides R&D solutions for printed circuit boards (PCB) and chip dissipation design, defect detection in finished or semi-finished electronic products, and pharmaceuticals, biomedical and material testing by identifying hot spots and heat anomalies.
This camera with a thermal sensitivity of 0.03℃ and resolution of up to 640 involves 20μm and 50μm macro lens and a 30°standard lens, which is mainly for accurate thermal measurements on small components, and a test bench helps users set up and start testing quickly. Besides, it can work in harsh environments with a measurement range of -20℃ to 650℃ and stays accurate at -20℃ to 65℃with an accuracy of ±2℃ or ±2%.
Micro-thermography Applications
1. PCB board
An infrared camera can quickly identify any components of PCB that are consuming current because any part drawing current generates heat, visualizing certain components heating excessively. Thermal inspection is an established procedure for failure detection and quality management– for both prototype development and serial production, which allows the following detections: hotspots and atypical temperature distributions on the PCB surface and multichip modules due to incorrect mounting, increased contact resistances caused by constriction of wires, hidden cracks in joints, power losses induced by RF mismatch, incorrect thermal connections of heat sinks, short circuits and cold solder joints (insufficient tin during soldering).
0s 6s 9s 17s
Imperfection in the circuit board was discovered shown as a hotspot. The heating process was monitored and recorded through FOTRIC AnalyzIR (Time: 0s, 6s, 9s, and 17s).
2. Chip dissipation
Chip dissipation is important due to its compactness, complex internal structure, and electronic shape miniaturization. Defective heat sinks seriously affect the chip performance and life, since overheating semiconductors may lead to a PN junction failure causing the device not to work properly.
Temperature measurement of a PCB chip is to test heating change under different functions.
Heat sinks transfer the heat created by a device to ensure the chip temperature stays within an appropriate range. To continue operating properly, the LED chip temperature should not exceed 120 °C with the help of heat sinking cooling the chip. If the heat sink is poorly designed or made of improper material, the heat dissipation will be seriously affected, thus shortening the chip service life or resulting in a change of LED color.
In an automotive headlight LED test, red dots in the center of the chip may gradually enlarge due to defective heat sinks, reducing the chip life. The alarm of AnalyzIR will be triggered when exceeding the critical temperature of 120 °C.
3. Finished electronic products
Electronics are becoming more powerful and smaller by placing components in a small space. Therefore, after the manufacturing process, defect detection of the finished or semi-finished products at ever smaller scales is a challenge, such as inspecting a circuit board with a cold solder joint, a defective semiconductor wafer, heat sink, LED, VCSEL, winding displacement, TV module, universal prototype board, atomizer heating wire of e-cigarette, DC converter of new energy vehicles, in-car microphone, etc.
A non-contact microscopic camera allows thermal analysis of extremely small structures in the micrometer range, offering a detailed representation of temperature distribution on complex electronic assemblies and components.
During the TV module aging test right after the manufacturing process, the temperature reached 93.8 ℃ unexpectedly which will result in rapid and premature aging and further caused a malfunction.
A faulty DC-to-DC converter is determined since the temperature reached 98.2 ℃ abnormally.
Car microphone PCB quality can be inspected by capturing the temperature distribution of the working circuit board and comparing it with the thermal field of a normal product to determine whether the product is defective. The left triode (blue box) plays a role in the first amplification stage, but it does not work in the defective product, meanwhile, the upper resistor and the right triode are slightly heated (purple box).
Normal car microphone PCB Defective car microphone PCB
LED beads are tested after the manufacturing process to help in quality control, and reasonable layout of heat-generating components, since local overheating due to poor dissipation shortens the LED life. In the figure, the non-uniform heat distribution of LED with high local temperature is discovered.
An 8-layer universal prototype circuit board is energized for testing and a short circuit occurred due to the faulty insulation of the board in the 2nd layer.
4. Biomedical and pharmaceutical testing
Research on targeted nanomaterials: 616C thermal camera with a 50μm macro lens is used to test and compare the solar thermal conversion efficiency of different targeted nanomaterials without interference before testing in vivo.
Detected by 50μm macro lens
5. Material testing
With powerful PC software, 600 R&D thermal cameras can test the performance through temperature changes of fibrous carbon material subjected to tension.
And test the thermal conductivity of two materials (two bars)as well.
RECOMMENDED THERMAL CAMERAS
FOTRIC 600 R&D station can better test the chip and discover the PCB design defects based on its advantages:
20μm & 50μm macro lens and great sensitivity of 30 mK.
Full radiometric video streams with an adjustable frame rate of up to 30Hz.
Brilliant measurement accuracy: ± 2 °C or ± 2 %, whichever is greater
Powerful analysis software on PC: AnalyzIR
MORE QUESTIONS?
To learn more about FOTRIC infrared thermal imaging cameras, please visit www.fotric.com or contact info@fotric.com for any inquiries.